Materials and Process Characterization for VLSI: Proceedings of the International Conference (ICMPC '88)

This collection of proceedings from the International Conference on Materials and Process Characterization for VLSI, held in 1988, offers a comprehensive exploration of the methodologies and advancements in the field of Very-Large-Scale Integration (VLSI) technology. Edited by X-f Zong and Y-y Wang, the volume highlights cutting-edge research and practical applications pertinent to the materials and processes that underpin modern integrated circuits.

The conference brought together leading experts who shared insights into the evolving landscape of VLSI. The contributions address a range of topics, from material properties to process innovations, reflecting the critical challenges and breakthroughs of the time. With a focus on improving performance and reliability in semiconductor devices, the proceedings serve as a valuable resource for researchers, engineers, and professionals looking to deepen their understanding of VLSI technology in the context of its foundational materials and processes.