説明
This volume delves into the critical advancements in materials and technologies pivotal for enhancing interconnects and low-k dielectrics, key components in electronic devices. It presents a comprehensive collection of research addressing the ever-evolving demands of microelectronics, focusing on innovative solutions that improve reliability and performance. The authors, each renowned in their respective fields, bring forth a wealth of knowledge that integrates theoretical insights with practical applications.
The proceedings capture a range of studies, from novel materials development to cutting-edge fabrication techniques. These contributions highlight the challenges and breakthroughs experienced in the industry, fostering a deeper understanding of how advanced materials can mitigate issues related to scalability and efficiency. As the electronic landscape continues to shift, the insights shared in this work serve as a valuable resource for researchers and practitioners aiming to push the boundaries of technology in interconnect design and dielectric applications.
The proceedings capture a range of studies, from novel materials development to cutting-edge fabrication techniques. These contributions highlight the challenges and breakthroughs experienced in the industry, fostering a deeper understanding of how advanced materials can mitigate issues related to scalability and efficiency. As the electronic landscape continues to shift, the insights shared in this work serve as a valuable resource for researchers and practitioners aiming to push the boundaries of technology in interconnect design and dielectric applications.
本の詳細
形式
ハードカバー
ページ数
616ページ
言語
英語
公開されました
4月 5, 2001
出版社
Cambridge University Press
版
1
ISBN-10
155899520X
ISBN-13
9781558995208
