Istfa 2002 With Cd-Rom

This proceedings from the November 2002 conference on the analysis of microelectronic device and system failures reflects the current unpredictability of economics and of the next generation of electronic mass products. The 102 papers explore metrology, materials, optical probing, system level analysis, and the failure analysis process. Topics include laser milling methods for package failure analysis, sample preparation for vertical transistors in DRAM, scanning SQUID microscopy for die level fault isolation, and driving baseline yields on ASICs using logic mapping. No subject index. The CD-ROM contains the full content of the papers. Annotation 2003 Book News, Inc., Portland, OR