描述
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
书籍详情
格式
平装书
页数
288 页
语言
英语
已发布
Dec 27, 2012
出版商
Springer
版本
2 个版本
ISBN-10
1461427487
ISBN-13
9781461427483