Compact Models and Measurement Techniques for High-Speed Interconnects
لا توجد تقييمات بعد
تنسيق
غلاف ورقي
صفحات
87
لغة
الإنجليزية
منشور
Feb 17, 2012
الناشر
Springer
رقم ISBN-10
1461410703
رقم ISBN-13
9781461410706
الوصف
In the world of high-speed interconnects, this work offers a comprehensive examination of the complex interplay between compact modeling and measurement techniques. The authors delve into the intricate challenges faced by engineers and researchers in the design of reliable high-speed communication systems. Their insights shed light on the need for precise modeling to navigate the evolving electrical standards and specifications.
Rohit Sharma and Tapas Chakravarty present a methodical approach, exploring various modeling techniques that effectively simulate interconnect behaviors. They address critical issues such as signal integrity, crosstalk, and power loss, ensuring that readers grasp the nuances of modern interconnect design. With rigorous experimentation and validation, the authors clarify how effective measurement techniques can significantly enhance performance in high-speed applications.
The text serves as a valuable resource for both practitioners and students, as it combines theoretical foundations with practical applications. Each chapter is designed to equip readers with the knowledge needed to tackle real-world challenges in the fast-paced realm of high-speed interconnect technologies.
Rohit Sharma and Tapas Chakravarty present a methodical approach, exploring various modeling techniques that effectively simulate interconnect behaviors. They address critical issues such as signal integrity, crosstalk, and power loss, ensuring that readers grasp the nuances of modern interconnect design. With rigorous experimentation and validation, the authors clarify how effective measurement techniques can significantly enhance performance in high-speed applications.
The text serves as a valuable resource for both practitioners and students, as it combines theoretical foundations with practical applications. Each chapter is designed to equip readers with the knowledge needed to tackle real-world challenges in the fast-paced realm of high-speed interconnect technologies.