Compact Models and Measurement Techniques for High-Speed Interconnects
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Formato
Brossura
Pagine
87
Lingua
Inglese
Pubblicato
Feb 17, 2012
Editore
Springer
ISBN-10
1461410703
ISBN-13
9781461410706
Descrizione
In the world of high-speed interconnects, this work offers a comprehensive examination of the complex interplay between compact modeling and measurement techniques. The authors delve into the intricate challenges faced by engineers and researchers in the design of reliable high-speed communication systems. Their insights shed light on the need for precise modeling to navigate the evolving electrical standards and specifications.
Rohit Sharma and Tapas Chakravarty present a methodical approach, exploring various modeling techniques that effectively simulate interconnect behaviors. They address critical issues such as signal integrity, crosstalk, and power loss, ensuring that readers grasp the nuances of modern interconnect design. With rigorous experimentation and validation, the authors clarify how effective measurement techniques can significantly enhance performance in high-speed applications.
The text serves as a valuable resource for both practitioners and students, as it combines theoretical foundations with practical applications. Each chapter is designed to equip readers with the knowledge needed to tackle real-world challenges in the fast-paced realm of high-speed interconnect technologies.
Rohit Sharma and Tapas Chakravarty present a methodical approach, exploring various modeling techniques that effectively simulate interconnect behaviors. They address critical issues such as signal integrity, crosstalk, and power loss, ensuring that readers grasp the nuances of modern interconnect design. With rigorous experimentation and validation, the authors clarify how effective measurement techniques can significantly enhance performance in high-speed applications.
The text serves as a valuable resource for both practitioners and students, as it combines theoretical foundations with practical applications. Each chapter is designed to equip readers with the knowledge needed to tackle real-world challenges in the fast-paced realm of high-speed interconnect technologies.
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