Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications

Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications

Michael Pecht , Luu T. Nguyen
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1995 · الإنجليزية · غلاف صلب
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الوصف

This work delves into the evolution and significance of plastic encapsulated microelectronics over the past two decades, showcasing the technological advancements that have shaped the field. The authors provide an in-depth analysis of the materials and processes involved in the encapsulation, highlighting their impact on quality and reliability.

Readers will gain insights into the challenges and solutions faced by the industry, emphasizing the importance of understanding physical properties and environmental factors that affect microelectronics. Throughout the narrative, the authors underscore the practical applications of these technologies, illustrating their relevance in modern electronics.

With a meticulous approach, the book serves as a vital resource for both professionals and students. It aims to bridge the gap between theoretical knowledge and real-world application, offering valuable perspectives that exemplify the growing importance of plastic encapsulated microelectronics in today's fast-paced technological landscape.

تفاصيل الكتاب

تنسيق غلاف صلب
صفحات 512 صفحات
لغة الإنجليزية
منشور Feb 6, 1995
الناشر Wiley-Interscience
رقم ISBN-10 0471306258
رقم ISBN-13 9780471306252

الأنواع

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