Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications

Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications

Michael Pecht , Luu T. Nguyen
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1995 · 英語 · ハードカバー
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説明

This work delves into the evolution and significance of plastic encapsulated microelectronics over the past two decades, showcasing the technological advancements that have shaped the field. The authors provide an in-depth analysis of the materials and processes involved in the encapsulation, highlighting their impact on quality and reliability.

Readers will gain insights into the challenges and solutions faced by the industry, emphasizing the importance of understanding physical properties and environmental factors that affect microelectronics. Throughout the narrative, the authors underscore the practical applications of these technologies, illustrating their relevance in modern electronics.

With a meticulous approach, the book serves as a vital resource for both professionals and students. It aims to bridge the gap between theoretical knowledge and real-world application, offering valuable perspectives that exemplify the growing importance of plastic encapsulated microelectronics in today's fast-paced technological landscape.

本の詳細

形式 ハードカバー
ページ数 512ページ
言語 英語
公開されました Feb 6, 1995
出版社 Wiley-Interscience
ISBN-10 0471306258
ISBN-13 9780471306252

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