الوصف
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
تفاصيل الكتاب
تنسيق
كتاب إلكتروني
صفحات
1,000 صفحات
لغة
الإنجليزية
منشور
Oct 19, 2004
الناشر
McGraw-Hill Companies
الطبعات
3 طبعات
رقم ISBN-10
0071776753
رقم ISBN-13
9780071776752