Description
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Book Details
Format
eBook
Pages
1,000 pages
Language
English
Published
Oct 19, 2004
Publisher
McGraw-Hill Companies
Editions
3 editions
ISBN-10
0071776753
ISBN-13
9780071776752