Описание
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Детали книги
Формат
электронная книга
Страницы
1,000 страниц
Язык
Английский
Опубликовано
Oct 19, 2004
Издатель
McGraw-Hill Companies
Издания
Изданий: 3
ISBN-10
0071776753
ISBN-13
9780071776752