توضیحات
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
جزئیات کتاب
فرمت
کتاب الکترونیکی
صفحات
1,000 صفحه
زبان
انگلیسی
منتشر شده
Oct 19, 2004
ناشر
McGraw-Hill Companies
نسخهها
3 نسخه
ISBN-10
0071776753
ISBN-13
9780071776752