描述
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
书籍详情
格式
电子书
页数
1,000 页
语言
英语
已发布
Oct 19, 2004
出版商
McGraw-Hill Companies
版本
3 个版本
ISBN-10
0071776753
ISBN-13
9780071776752