Descripción
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Detalles del libro
Formato
Libro electrónico
Páginas
1,000 páginas
Idioma
Inglés
Publicado
Oct 19, 2004
Editorial
McGraw-Hill Companies
Ediciones
3 ediciones
ISBN-10
0071776753
ISBN-13
9780071776752