Beschreibung
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Buchdetails
Format
E-Book
Seiten
1,000 Seiten
Sprache
Englisch
Veröffentlicht
Oct 19, 2004
Verlag
McGraw-Hill Companies
Ausgaben
3 Ausgaben
ISBN-10
0071776753
ISBN-13
9780071776752