Beschrijving
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Boekdetails
Formaat
eBook
Pagina's
1,000 pagina's
Taal
Engels
Gepubliceerd
Oct 19, 2004
Uitgever
McGraw-Hill Companies
Edities
3 edities
ISBN-10
0071776753
ISBN-13
9780071776752