Opis
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Szczegóły książki
Format
eBook
Strony
1,000 stron
Język
Angielski
Opublikowany
Oct 19, 2004
Wydawca
McGraw-Hill Companies
Wydania
Wydania: 3
ISBN-10
0071776753
ISBN-13
9780071776752