Description
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Détails du livre
Format
livre numérique
Pages
1,000 pages
Langue
Anglais
Publié
Oct 19, 2004
Éditeur
McGraw-Hill Companies
Éditions
3 éditions
ISBN-10
0071776753
ISBN-13
9780071776752