설명
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
책 세부 정보
형식
전자책
페이지
1,000 페이지
언어
영어
출판됨
Oct 19, 2004
출판사
McGraw-Hill Companies
판본
판본 3개
ISBN-10
0071776753
ISBN-13
9780071776752