Descrizione
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Dettagli del libro
Formato
eBook
Pagine
1,000 pagine
Lingua
Inglese
Pubblicato
Oct 19, 2004
Editore
McGraw-Hill Companies
Edizioni
3 edizioni
ISBN-10
0071776753
ISBN-13
9780071776752