説明
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
本の詳細
形式
電子書籍
ページ数
1,000ページ
言語
英語
公開されました
Oct 19, 2004
出版社
McGraw-Hill Companies
版
3 版
ISBN-10
0071776753
ISBN-13
9780071776752