Descrição
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.
Detalhes do Livro
Formato
eBook
Páginas
1,000 páginas
Idioma
Inglês
Publicado
Oct 19, 2004
Editora
McGraw-Hill Companies
Edições
3 edições
ISBN-10
0071776753
ISBN-13
9780071776752